1)The feeding part can automatic or manual feeding.unit can remove when use the manual feeding style.
2)The machin process:auto feeding base paper(sheet style)-auto coating-auto lamination the silicon paper
(automatic cut the silicon paper to appropriate size )-finish(there have the collect box in last of the machine)
3)hotmelt machine(45kg):put the glue in the melt machine,automatic melting,then across to glue hose sending to the glue gun coating the glue to the paper
4)silicon paper(roller style ),after cut to need size sending to the adsorb laminating device,then if the
photoelectricity switch response the base paper come,the stepper motor will take the silicon laminator with the base paper
6)the max coating size:210mm max pass size of board 230mm,if other size requirement,also can produce. 7)match with the HG845 style hot melt machine the capacity is 45kg
8)the machine can adjust the glue coating weight,and the glue coat the width

9)the machine is plc control ,can show the capacity of products and the speed of per hour.On the touch screeen 10)At the end of machine there will be an extra movable conveyor of 1.5mtr so that the operator is away from    the silicon roll.